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As demand for semiconductors skyrocketed up due to demands in computing, storage, automation, electric cars, and smart devices rose at an extremely fast pace, semiconductor manufacturers need to keep up by ramping up production. Economic performance can be greatly improved during this high-demand cycle if manufacturing yield can be kept at a constant rate or lower.

Early defect detection at a die level can greatly reduce the risk of defective products from passing through to the next process. New packaging methods such as bare and stacked dies would increase scanning complexities which only metrology scanning devices sold by big brands have the ability to address the issue.

Lhinosight can help to improve manufacturing yield by designing tailor-made defect detection and classification program. Lhinosight is powered by experienced integrated circuit designer, semiconductor manufacturing expert, and deep learning artificial intelligence expert to help your journey to higher manufacturing yield.

• Wafer Surface defect classification

• Diced chip defect detection

• Die crack detection

• Fine cracks and chipping detection and measurement

• Nonuniform solder ball detection and measurement

• Contamination layer detection and measurement

• Missing components

• Solder bridging (short) detection and measurement

• Cold joints detection and measurement

• Lifted pads detection

• Component shift detection

• Webbing and splashes detection